This week, the ratings of six Internet and Web Service stocks on Portfolio Grader are down. Each of these rates a “D” (“sell”) or “F” overall (“strong sell”).
Youku Tudou, Inc. Sponsored ADR Class A (NYSE:) is on the decline this week, earning a D (“sell”) after receiving a C (“hold”) last week. Youku.com operates as an Internet television company in the People�s Republic of China. In Portfolio Grader’s specific subcategories of Earnings Revisions and Equity, YOKU also gets F’s. .
Hot Semiconductor Companies To Own In Right Now: Advanced Semiconductor Engineering Inc (ASX)
Advanced Semiconductor Engineering, Inc. is principally engaged in the manufacture, assembly, processing, testing and distribution of integrated circuits (ICs). The Company provides semiconductor packaging and testing services, including plastic leaded chip carriers (PLCCs), quad flat packages (QFPs) and flip chip packaging technology, among others, which are applied in the manufacture of household electrical appliances, communication devices, automobile components, personal computers, set top boxes, servers, memory integrated circuits (ICs), mobile phones, digital cameras, game consoles, projectors, high definition (HD) televisions, wireless communication network products and power management ICs, among others. The Company operates its businesses primarily in Taiwan, Europe and the Americas. In August 2010, the Company acquired a 100% interest in EEMS Test Singapore.
The Company is focused on packaging and testing logic semiconductors. The Company offers its customers turnkey services, which consist of packaging, testing and direct shipment of semiconductors to end users designated by its customers. The Company�� global base of over 200 customers includes semiconductor companies across a range of end use applications, including Altera Corporation, ATI Technologies, Inc., Broadcom Corporation, Cambridge Silicon Radio Limited and Microsoft Corporation. During the year ended December 31, 2008, the Company�� packaging revenues accounted for 77.7% of its net revenues and its testing revenues accounted for 20.1% of its net revenues.
Packaging Services
The Company offers a range of package types to meet the requirements of its customers, with a focus on packaging solutions. Within its portfolio of package types, the Company focuses on the packaging of semiconductors. These include advanced leadframe-based package types, such as quad flat package, thin quad flat package, bump chip carrier and quad flat no-lead package, and package types based on substrates, such a! s flip-chip ball grid array (BGA) and other BGA types, as well as other packages, such as wafer-bumping products. Leadframe-based packages are packaged by connecting the die, using wire bonders, to the leadframe with gold wire. The Company�� leadframe-based packages include quad flat package (QFP)/ thin quad flat package (TQFP), quad flat no-lead package (QFN)/microchip carrier (MCC), advanced quad flat no-lead package (AQFN), bump chip carrier (BCC), small outline plastic package (SOP)/thin small outline plastic package (TSOP), small outline plastic j-bend package (SOJ), plastic leaded chip carrier (PLCC) and plastic dual in-line package (PDIP). Substrate-based packages employ the BGA design, which utilizes a substrate rather than a leadframe. It also assembles system-in-a-package products, which involve the integration of more than one chip into the same package. The Company�� substrate-based packages include Plastic BGA, Cavity Down BGA, Stacked-Die BGA, Flip-Chip BGA and land grid array (LGA).
The Company�� wafer-level packaging products include wafer level chip scale package (aCSP) and advanced wafer level package (aWLP). The Company offers module assembly services, which combine one or more packaged semiconductors with other components in an integrated module to enable functionality, typically using surface mount technology (SMT) machines and other machinery and equipment for system-level assembly. End use applications for modules include cellular phones, personal digital assistant (PDAs), wireless local area network (LAN) applications, bluetooth applications, camera modules, automotive applications and toys.
The Company provides module assembly services primarily at its facilities in Korea for radio frequency and power amplifier modules used in wireless communications and automotive applications. Interconnect materials connect the input/output on the semiconductor dies to the printed circuit board. Interconnect materials include substrate, which is a multi-layer m! iniature ! printed circuit board. The Company produces substrates for use in its packaging operations.
Testing Services
The Company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, final testing of logic/mixed-signal/radio frequency (RF) and memory semiconductors and other test-related services. The Company provides front-end engineering testing services, including customized software development, electrical design validation, and reliability and failure analysis. The Company provides final testing services for a variety of memory products, such as static random access memory (SRAM), dynamic random access memory (DRAM), single-bit erasable programmable read-only memory semiconductors and flash memory semiconductors.
The Company provides a range of additional test-related services, including burn-in testing, module sip testing, dry pack, tape and reel, and electric interface board and mechanical test tool design. The Company offers drop shipment services for shipment of semiconductors directly to end users designated by its customers.
Advisors' Opinion:- [By David Dittman]
Crown Resorts is a buy all the way up to USD16.50 on the Australian Securities Exchange (ASX) using the symbol CWN and on the US over-the-counter (OTC) market using the symbol CWLDF.
- [By Jeff Reeves]
Advanced Semiconductor Engineering�(ASX) builds and distributes integrated circuits and other electronics. It�� not as sexy as some mobile chipmakers, but thankfully it doesn�� have to be — ASX is simply capitalizing on the general demand for microchips in everything from cars to computers to TVs.
- [By Namitha Jagadeesh]
The FTSE 100 Index (UKX) fell 1.31 points, less than 0.1 percent, to 6,679.77 at 10:12 a.m. in London, trimming an earlier decline of as much as 0.6 percent. The gauge has climbed 13 percent this year as central banks maintained stimulus measures to support the global economy. The broader FTSE All-Share Index (ASX) was also little changed today, while Ireland�� ISEQ Index retreated 0.3 percent.
- [By Adam Haigh]
ASX Ltd. (ASX) posted the biggest weekly loss in 3 1/2 years, falling 6.1 percent to A$33.15, amid a A$553 million ($530 million) capital raising at the operator of Australia�� main stock exchange to ensure its clearing business complies with new regulations.
Hot Semiconductor Companies To Own In Right Now: Peregrine Semiconductor Corp (PSMI)
Peregrine Semiconductor Corporation (Peregrine), incorporated in February 1990, is engaged in the design, manufacturing and marketing radio frequency integrated circuits (RFICs) for the aerospace and defense, broadband, industrial, mobile wireless device, test and measurement equipment, and wireless infrastructure markets. The Company is provider of RFICs. Its products include RF switches-antenna, RFswitches-broadband and general purpose, digital attenuators, synthesizers, mixers/upconverters, prescalers, variable gain amplifiers, digitally tunable capacitors, DC-DC converters and power amplifiers. Its UltraCMOS technology enables the design, manufacture, and integration of multiple radio frequency (RF), mixed signal, and digital functions on a single chip. Its solutions target a range of applications in the aerospace and defense, broadband, industrial, mobile wireless device, test and measurement equipment, and wireless infrastructure markets.
As of December 25, 2010, The Company offers a portfolio of more than 120 RFICs, including switches, digital attenuators, mixers/upconverters, and prescalers, and it is developing power amplifiers (Pas), digitally tunable capacitors (DTCs), and DC-DC converters. During the fiscal year ended December 25, 2010, its products were sold to more than 1,400 module manufacturers, original equipment manufacturers (OEMs), contract manufacturers, and other customers, including such companies as Amalfi Semiconductor, Inc., The Boeing Company, EPCOS AG, Ericsson AB, Hitachi Media Electronics Company, Ltd., Hitachi Metals, Ltd., Humax Co., Ltd., Itron, Inc., LG Innotek Co., Ltd., Mini-Circuits, Inc., Motorola, Inc., Murata Manufacturing Company, Ltd., Planet Technology Corp., Rockwell Collins, Inc., Rohde & Schwarz, Inc., SIPAT Co., Ltd., Skyworks Solutions, Inc., Sony Corporation, Source Photonics, Inc., and Thales Alenia Space.
RF switches-antenna
RF Switches are utilized in the RF section of mobile devices to route RF signals between! the antenna and the handset core, through one or more signal paths. For mobile handsets, its switch products offer up to 10 RF signal paths with integrated digital bus support and onboard voltage regulation.
RFswitches-broadband and general purpose
The Company�� broadband and general purpose RF switches deliver combination of broadband linearity, settling time, and isolation while routing RF signals to their respective transmit or receive paths. Its attributes are being used by the OEMs of LED and plasma digital televisions (DTVs), set top box, cable infrastructure, test and measurement devices
Digital Attenuators
The Company provides digital step attenuators that are used to control the amplitude of an RF or analog signal. The products include digital control circuitry integrated with an RF attenuator core and are used in third generation (3G) and fourth generation (4G) cellular base stations, repeaters, and point-to-point nodes.
Synthesizers
The Company�� frequency synthesizers provide an electronic system for generating any of a range of frequencies from a single fixed timebase or oscillator. Its synthesizers provide low-power, ultra-low phase noise, programmable frequency synthesis for defense, broadband, industrial, and wireless infrastructure markets.
Mixers/Upconverters
The Company�� mixers/upconverters are used to translate encoded voice/data signals from one frequency to another to enable radio transmission. Its mixers / upconverters are incorporated into mixer modules and provide industry linearity, which is a metric to maximizing wireless data transmission rates. These attributes are critical in 3G and 4G cellular base station designs.
Prescalers
The Company�� prescalers operate in the C, X, and Ku bands to divide the frequency of a wireless signal in order to extend the operating range of a synthesizer beyond its base capability. Its prescalers complem! ent its f! requency synthesizer line, providing its customers with design.
Variable Gain Amplifiers
The Company�� Variable Gain Amplifiers (VGAs) are used in both the receiving and transmitting path of a radio system to maintain a signal�� strength at a level necessary for other circuits to operate optimally. Its DVGA is the monolithic integrated circuit (IC) to integrate three functional blocks, including digital attenuators, RF/IF amplifiers and a common serial interface onto a single IC.
DC-DC Converters
The Company�� frequency-configurable DC-DC converters efficiently perform voltage conversion using a high frequency switching technique that minimizes system noise. Its DC-DC converters are designed to enable a distributed power management architecture designed for satellite applications, replacing inefficient drop out regulators and central converters.
Power Amplifiers
The Company�� PAs amplify RF signals in order to generate the necessary power required to establish a radio link between a base station and a mobile device. With its UltraCMOS technology the Company has the ability to integrate its PAs on a single chip with other RF, mixed signal, and digital components.
The Company competes with Hittite, M/A-COM, NEC, Renesas, RFMD, Skyworks, Sony, Toshiba and TriQuint Semiconductor.
Advisors' Opinion:- [By Lee Jackson]
Peregrine Semiconductor Corp. (NASDAQ: PSMI) is a lesser known name that is a top stock to buy at Deutsche Bank. The company recently released a new radio frequency (RF) switch specifically designed for broadband cable systems. With HD content exploding, this could be a huge home run for the company. Deutsche Bank has a $14 price target for the stock, the same as the consensus target.
Top 10 Safest Stocks For 2014: Advanced Semiconductor Engineering Inc (ASX)
Advanced Semiconductor Engineering, Inc. is principally engaged in the manufacture, assembly, processing, testing and distribution of integrated circuits (ICs). The Company provides semiconductor packaging and testing services, including plastic leaded chip carriers (PLCCs), quad flat packages (QFPs) and flip chip packaging technology, among others, which are applied in the manufacture of household electrical appliances, communication devices, automobile components, personal computers, set top boxes, servers, memory integrated circuits (ICs), mobile phones, digital cameras, game consoles, projectors, high definition (HD) televisions, wireless communication network products and power management ICs, among others. The Company operates its businesses primarily in Taiwan, Europe and the Americas. In August 2010, the Company acquired a 100% interest in EEMS Test Singapore.
The Company is focused on packaging and testing logic semiconductors. The Company offers its customers turnkey services, which consist of packaging, testing and direct shipment of semiconductors to end users designated by its customers. The Company�� global base of over 200 customers includes semiconductor companies across a range of end use applications, including Altera Corporation, ATI Technologies, Inc., Broadcom Corporation, Cambridge Silicon Radio Limited and Microsoft Corporation. During the year ended December 31, 2008, the Company�� packaging revenues accounted for 77.7% of its net revenues and its testing revenues accounted for 20.1% of its net revenues.
Packaging Services
The Company offers a range of package types to meet the requirements of its customers, with a focus on packaging solutions. Within its portfolio of package types, the Company focuses on the packaging of semiconductors. These include advanced leadframe-based package types, such as quad flat package, thin quad flat package, bump chip carrier and quad flat no-lead package, and package types based on substrates, such a! s flip-chip ball grid array (BGA) and other BGA types, as well as other packages, such as wafer-bumping products. Leadframe-based packages are packaged by connecting the die, using wire bonders, to the leadframe with gold wire. The Company�� leadframe-based packages include quad flat package (QFP)/ thin quad flat package (TQFP), quad flat no-lead package (QFN)/microchip carrier (MCC), advanced quad flat no-lead package (AQFN), bump chip carrier (BCC), small outline plastic package (SOP)/thin small outline plastic package (TSOP), small outline plastic j-bend package (SOJ), plastic leaded chip carrier (PLCC) and plastic dual in-line package (PDIP). Substrate-based packages employ the BGA design, which utilizes a substrate rather than a leadframe. It also assembles system-in-a-package products, which involve the integration of more than one chip into the same package. The Company�� substrate-based packages include Plastic BGA, Cavity Down BGA, Stacked-Die BGA, Flip-Chip BGA and land grid array (LGA).
The Company�� wafer-level packaging products include wafer level chip scale package (aCSP) and advanced wafer level package (aWLP). The Company offers module assembly services, which combine one or more packaged semiconductors with other components in an integrated module to enable functionality, typically using surface mount technology (SMT) machines and other machinery and equipment for system-level assembly. End use applications for modules include cellular phones, personal digital assistant (PDAs), wireless local area network (LAN) applications, bluetooth applications, camera modules, automotive applications and toys.
The Company provides module assembly services primarily at its facilities in Korea for radio frequency and power amplifier modules used in wireless communications and automotive applications. Interconnect materials connect the input/output on the semiconductor dies to the printed circuit board. Interconnect materials include substrate, which is a multi-layer m! iniature ! printed circuit board. The Company produces substrates for use in its packaging operations.
Testing Services
The Company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, final testing of logic/mixed-signal/radio frequency (RF) and memory semiconductors and other test-related services. The Company provides front-end engineering testing services, including customized software development, electrical design validation, and reliability and failure analysis. The Company provides final testing services for a variety of memory products, such as static random access memory (SRAM), dynamic random access memory (DRAM), single-bit erasable programmable read-only memory semiconductors and flash memory semiconductors.
The Company provides a range of additional test-related services, including burn-in testing, module sip testing, dry pack, tape and reel, and electric interface board and mechanical test tool design. The Company offers drop shipment services for shipment of semiconductors directly to end users designated by its customers.
Advisors' Opinion:- [By Alexis Xydias]
The FTSE 100 Index (UKX) gained 53.93 points, or 0.8 percent, to 6,683.93 at 8:58 a.m. in London, rebounding from a 1.4 percent loss yesterday. The benchmark has rallied 13 percent this year as central banks around the world commit to maintain monetary stimulus to nurture economic growth. The broader FTSE All-Share Index (ASX) increased 0.8 percent today, while Ireland�� ISEQ Index advanced 0.5 percent.
- [By Seth Jayson]
Advanced Semiconductor Engineering (NYSE: ASX ) is expected to report Q2 earnings around July 7. Here's what Wall Street wants to see:
- [By Namitha Jagadeesh]
The FTSE 100 Index (UKX) fell 1.31 points, less than 0.1 percent, to 6,679.77 at 10:12 a.m. in London, trimming an earlier decline of as much as 0.6 percent. The gauge has climbed 13 percent this year as central banks maintained stimulus measures to support the global economy. The broader FTSE All-Share Index (ASX) was also little changed today, while Ireland�� ISEQ Index retreated 0.3 percent.
Hot Semiconductor Companies To Own In Right Now: Fairchild Semiconductor International Inc (FCS)
Fairchild Semiconductor International, Inc. (Fairchild) focuses on developing, manufacturing and selling power analog, power discrete and certain non-power semiconductor solutions to a range of end market customers. The Company is a supplier of power analog products, power discrete products and energy-efficient solutions, according to iSuppli. Its products are used in a range of electronic applications, including sophisticated computers and Internet hardware; communications, including wireless phones; networking and storage equipment; industrial power supply and instrumentation equipment; consumer electronics, such as digital cameras, displays, audio/video devices and household appliances, and automotive applications.
The Company�� product groups are organized by the end markets, which include Mobile, Computing, Consumer and Communication (MCCC), Power Conversion, Industrial and Automotive (PCIA) and Standard Discrete and Standard Linear (SDT). It invested in the wafer fabrication power semiconductor technology, including low and mid voltage PowerTrench, advanced insulated gate bipolar transistor (IGBT), as well as advanced high power metal oxide semiconductor field effect transistors (MOSFET) fabrication technologies.
Mobile, Computing, Consumer and Communication (MCCC)
The Company designs, manufactures and markets high-performance analog and mixed signal integrated circuits, low voltage power MOSFETs for mobile, consumer, computing, and communication applications. It has a portfolio of PowerTrench technology products. Its analog and mixed signal products are focused on the mobile end- markets.
Analog products monitor, interpret, and control continuously variable functions, such as light, color, sound, and energy. It forms the interface with the digital world. It provides a range of analog products that perform such tasks as voltage regulation, audio amplification, power and signal switching and system management. Analog voltage regulation circ! uits are used to provide constant voltages, as well as step up or step down voltage levels on a circuit board. These products enable improvements in power efficiency, lighting management, and improve charge times in ultraportable products. These products are used in a variety of mobile, computing, communications and consumer applications.
In addition to the power analog and interface products, it also offers signal path products. These include analog and digital switches, universal serial bus (USB) switches, video filters and high performance audio amplifiers. The analog switch functions are typically found in cellular handsets and other ultra portable applications. The video products provide a single chip solution to video filtering and amplification. Video filtering applications include set top boxes and digital television. Its solutions include surface mount devices, tiny packages, chip scale packages, and leadless carriers.
The Company also design, manufacture and market power semiconductor solutions for computing, communications, mobile, consumer and industrial applications. Power semiconductor solutions include, power discrete MOSFETs, analog integrated circuits, and fully integrated multi-chip and monolithic power solutions. Its power MOSFETs are primarily used in power delivery and power control applications. Power delivery and control applications are ubiquitous across data consumption, processing and communication applications. It produces advanced low power MOSFETs under its PowerTrench brands. The advanced power MOSFETs applications are used in smartphones, tablets, notebook personal computer, high performance gaming, home entertainment systems, servers, data communication, and routers.
The Company competes with Analog Devices, Inc., Linear Technology Corporation, Maxim Integrated Product, Inc., Micrel Inc, ON Semiconductor Corporation, ST Microelectronics N.V., Intersil Corporation, International Rectifier Corporation, Infineon Technologies AG and T! exas Inst! ruments Incorporated.
Power Conversion, Industrial and Automotive (PCIA)
Fairchild design, manufacture and market power discrete semiconductors, analog and mixed signal integrated circuits (ICs) for broad power conversion/power management, industrial, and automotive applications. Its products are building blocks that help convert a semi-regulated energy source (alternating current (AC)or direct current (DC)) to a regulated output for electronic systems (AC-DC, DC-AC, and DC-DC conversion). Its discrete devices are individual diodes or transistors that perform power switching, power conditioning and signal amplification functions in electronic circuits. The Company�� analog and mixed signal integrated circuits (IC) are used to control discrete semiconductors in applications, such as power switching, conditioning, signal amplification, power distribution and power consumption. It manufacture discrete products using vertical DMOS MOSFETs, Insulated Gate Bipolar Transistors (IGBT), Bipolar, and ultrafast rectifier technologies. It manufacture analog and mixed signal ICs using a range of bipolar (Bi), complementary metal oxide (CMOS), BiCMOS, and bipolar/CMOS/DMOS (BCDMOS) processes up to 1,200 volts and down to 0.35um (microns) minimum geometry.
Power MOSFETs are used in applications to switch, shape or transfer energy. These products are used in a range of high-growth applications, including solar inverters, uninterruptible power supplies (UPS), data centers and communications, motors, lighting, automotive, computing, displays and industrial supplies. It produce advanced power MOSFETs under its SupreMOS, SuperFET, PowerTrench, UniFET and QFET brands. IGBTs are high-voltage power discrete devices. They are used in switching applications for solar inverters, uninterruped power supply, data centers and communications, motors, industrial, power supplies, displays, television and automotive ignition systems. These applications require lower switching frequencies, highe! r power, ! and/or higher voltages than a power MOSFET can provide. It is a supplier of IGBTs. Rectifier products work with IGBTs and MOSFETs in many applications to provide power conversion and conditioning. Its product is the STEALTH rectifier, providing industry performance and efficiencies in data communications, industrial power supply, displays, television, and motor applications.
Leveraging its power MOSFET and IGBT technologies, it also design and manufacture modules for the industrial, automotive, and home appliance end markets. It design and develop a line of smart power modules (SPM) products targeted to various end applications in consumer white goods and industrial applications, which include room air conditioners, industrial power supplies, solar inverters, pumps, and industrial motors. These are multi-chip modules containing up to 28 components in a single package that includes diodes, power discrete IGBTs or MOSFETs, high voltage power management driver ICs and current and temperature sensors. Similar modules, called APM, are used in automotive applications.
The Company design and manufacture power management semiconductors for line-powered and off-line powered systems that integrate its Power MOSFETs. It sell and market off-line and isolated DC-DC ICs, MOSFET and IGBT gate driver ICs, and power factor correction ICs to the consumer, computing, display, television, lighting and industrial segments.
The Company competes with Infineon Technologies AG, ST MicroelectronicsN.V., International Rectifier Corporation, Toshiba Corporation, Mitsubishi Corporation, Texas Instruments Incorporated, Power Integrations, Inc., ON Semiconductor Corporation, NXP Semiconductors N.V. and Vishay Intertechnology, Inc.
Standard Linear and Standard Discrete (SDT)
Standard Diodes and Transistors products cover a range of semiconductor products, including MOSFET, junction field effect transistors (JFETs), high power bipolar, discrete small signal transistors, TVS,! Zeners, ! rectifiers, bridge rectifiers, Schottky devices and diodes. The Company design, manufacture and market analog integrated circuits for computing, consumer, communications, ultra-portable and industrial applications. These products are manufactured using bipolar, CMOS and BiCMOS technologies. Standard Linear solutions range from bipolar regulators, shunt regulators, low drop out regulators, standard op-amp/comparators, low voltage op-amps, and others. Analog voltage regulator circuits are used to provide constant voltages, as well as to step up or step down voltage levels on a circuit board. Op-amps/comparators are designed specifically to operate from a single power supply over a range of voltages. It also offer low-voltage op-amps that provide a combination of low power, rail-to-rail performance, low voltage operation, and tiny package options which are well suited for use in personal electronics equipment. Its solutions include surface mount devices, tiny packages and leadless carriers.
The Company competes with International Rectifier Corporation, Diodes Incorporated, NXP Semiconductors N.V., ST Microelectronics N.V., ON Semiconductor Corporation, Texas Instruments Incorporated, Vishay Intertechnology, Inc., Vishay Intertechnology, Inc, Osram Opto Semiconductors, OPTEK Technology, OMRON Corporation, Avago Technologies Ltd. and Kodenshi Corp.
Advisors' Opinion:- [By Brian Pacampara]
What: Shares of power chip specialist Fairchild Semiconductor (NYSE: FCS ) sank 10% today after its quarterly results and outlook missed Wall Street expectations.
Hot Semiconductor Companies To Own In Right Now: NeoPhotonics Corp (NPTN)
NeoPhotonics Corporation, incorporated on October 31, 1996, is a designer and manufacturer of photonic integrated circuit (PIC)-based modules and subsystems for bandwidth-intensive, high-speed communications networks. The Company has a portfolio of over 300 products, including products that enable data transmission at 10 gigabytes per second, 40 gigabytes per second and 100 gigabytes per second, agility products, such as reconfigurable optical add/drop multiplexers (ROADMs) that allocate bandwidth to adjust for volatile traffic patterns, and access products that provide high-bandwidth connections to more devices and people over fixed and wireless networks. In October 2011, the Company acquired Santur Corporation. In June 2013, it announced first shipments of optical transceiver modules out of its new, high capacity factory in Dongguan, Guangdong Province, China.
The Company�� products are categorized in 34 product families. The Company sells its products to the network equipment vendors globally, including ADVA AG Optical Networking Ltd., Alcatel-Lucent SA, Ciena Corporation (including its recent acquisition of Nortel�� Metro Ethernet Networks business), Cisco Systems, Inc., FiberHome Technologies Group, ECI Telecom Ltd., Telefonaktiebolaget LM Ericsson, Fujitsu Limited, Harmonic, Inc., Huawei Technologies Co., Ltd., Mitsubishi Electric Corporation, NEC Corporation, Nokia Siemens Networks B.V. and ZTE Corporation.
The Company competes with Finisar Corporation, JDS Uniphase Corporation, MRV Communications, Inc., NTT Electronics Corporation and Sumitomo Electric Device Innovations, Inc.
Advisors' Opinion:- [By Anders Bylund]
Close competitor NeoPhotonics (NYSE: NPTN ) soared 15% higher. Larger rival JDS Uniphase (NASDAQ: JDSU ) jumped 7.9% to become the fastest gainer on the S&P 500. If Ciena can beat its own expectations in selling Internet backbone equipment to a bevy of major telecoms, its chief rivals must eventually follow suit. JDS is only one month removed from its latest quarterly report, which sent shares diving 7% overnight (but all was forgiven a week later). NeoPhotonics also reported in early May, but didn't make any waves then.
Hot Semiconductor Companies To Own In Right Now: Tokyo Electron Ltd (TOELY.PK)
Tokyo Electron Limited is a company mainly engaged in the manufacture and sale of electronic products for industrial uses. The Semiconductor Manufacturing Equipment, Flat-panel Display (FPD) and Photovoltaic Cell (PV) Manufacturing Equipment segment provides coaters and developers for wafer processing, plasma etching equipment, thermal processing systems, single wafer deposition systems, cleaning systems, coaters and developers for FPD manufacturing, ashing devices and plasma chemical vapor deposition (CVD) devices. The Electronic Component and Information Communication Equipment segment designs, develops, purchases and sells semiconductor products such as integrated circuits (ICs), computer and network equipment and software. The Others segment involves in logistics, facility management and insurance businesses. On April 1, 2013, it merged with two subsidiaries. In January 2014, the Company established TEL-Applied Holdings B.V. and a Japan-based company. Advisors' Opinion:- [By Stephen Simpson, CFA]
Ultratech isn't the only game in town, though, and there are multiple technologies and process steps that are going to play significant roles in the production of FinFETs and 3D circuits. With that, I would take a look at Mattson Technologies (MTSN), as this company has already accomplished the not-so-easy task of gaining meaningful share in the dry strip, rapid thermal processing (RTP), and etch markets despite competing with giants like Lam Research (LRCX), Applied Materials (AMAT), and Tokyo Electron (TOELY.PK).
Hot Semiconductor Companies To Own In Right Now: GigOptix Inc (GIG)
GigOptix, Inc. (GigOptix), incorporated on March 2008, is a supplier of semiconductor and electro-optical component products that enables high-speed end to end data streaming over optical fiber and wireless telecommunications and data-communications networks globally. The Company's products convert signals between electrical and optical formats for transmitting and receiving data over fiber optic networks and between electrical and high speed radio frequencies to enable the transmission and receipt of data over wireless networks. The Company is creating both optical telecommunications and data-communications applications for fast growing markets in 10 giga bytes per second (Gbps), 40Gbps and 100Gbps drivers, receiver integrated circuits (IC), electro-optic modulator components and multi-chip-modules (MCM), as well as E-band wireless data-communications applications for high speed mobile backhaul and other high capacity wireless data transport applications. During the year ended December 31, 2011, the Company shipped over 150 products to over 200 customers.
The Company offers a portfolio of 10Gbps and 40Gbps electro-optical products and is developing market for 100Gbps products. The Company provides bundled solutions that consist of a few of its products, such as modulator and driver. The Company also offers a comprehensive portfolio of Monolithic Microwave Integrated Circuit (MMIC) and application-specific integrated circuit (ASIC) products to support E-band wireless communication and defense markets. The Company has also developed 10Gbps vertical cavity surface-emitting laser (VCSEL) drivers and receivers for aerospace as well as outdoor, non-temperature controlled environments that enables higher capacity in its customers' next generation flight and data center systems.
The Company has a portfolio of products for telecommunications , data-communications, defenses and industrial applications designed for optical speeds from 3Gbps to over 100Gbps and for wireless frequencies! from zero giga hertz (GHz) to 86GHz. The Company's products support a range of data rates, protocols, transmission distances and industry standards.
The Company's portfolio consists of the product ranges, such as laser and modulator drivers for 10Gbps, 40Gbps and 100Gbps applications; receiver amplifiers or Trans-impedance Amplifiers (TIAs) for 10Gbps, 40Gbps and 100Gbps applications; VCSEL driver and receiver chipsets for 14 and 12 channel parallel optics applications from 3Gbps to 10Gbps; Electro-optic modulators based on the Company's TFPS technology suitable for various 40Gbps and 100Gbps modulation schemes, such as differential phase shift keying (DPSK), differential quadrature phase shift keying (DQPSK), RZ-DQPSK and DP-QPSK; wideband monolithic microwave integrated circuit (MMIC) amplifiers with flat gain response; high frequency MMIC Power Amplifiers with high gain and output power; high frequency passive attenuators and filters in small form factors, and standard cell, and structured ASIC and hybrid ASIC designs and manufacturing service for multiple markets offering information technology acquisition review (ITAR) compliance for defense applications. The Company designs and market products that amplifies electrical signals during both the transmission (amplifiers and optical drivers) and reception (TIAs) of optical signals as well as modulate optical signals in the transmission of data.
The Company's optical drivers amplify the input digital data stream that is used to modulate laser light either by direct modulation of the laser or by use of an external modulator that acts as a precise shutter to switch on and off light to create the optical data stream. The Company supplies an optimized component for each type of laser, modulator and photo-diode depending upon the speed, reach and required cost. The Company's microwave and millimeter wave amplifiers amplify small signal radio signals into more signals that can be transmitted over long distances to establish high t! hroughput! data connections or enable radar based applications. The Company's ASIC solutions are used in a number of applications such as defense and test and measurement applications to enable the high speed processing of complex signals.
The Company's product portfolio is designed to cover the range of solutions needed in these different modules. The Company's product portfolio consists of five product lines: GX Series, which includes serial drivers and TIA ICs devices for telecom and data-com markets; HX Series, which includes multi-channel driver and TIA ICs for short reach data-com and optical interconnect applications; LX Series, which includes TFPS modulators for high speed telecom and defense applications; EX Series, which includes amplifiers, filters and attenuators for microwave applications in defense and instrumentation, and CX Series, which includes family of ASIC solutions for custom integrated circuit design.
GX Series
The GigOptix GX Series of products services both the telecom and data-com markets with a broad portfolio of drivers and transimpedence amplifiers that address 10Gbps, 40Gbps and 100Gbps speeds over distances that range from 100 meters to 10,000 kilometers. The GX Series devices are used in FiberChannel, Ethernet, synchronous optical networking (SONET)/ synchronous digital hierarchy (SDH) components and those based upon the optical internetworking forum (OIF) standards.
HX Series
The GigOptix HX Series of products service the high performance computing (HPC), data-com and consumer markets with a portfolio of parallel VCSEL drivers and TIAs that address 3Gbps, 5Gbps,10Gbps, 14Gbps, 16Gbps and 25Gbps channel speeds over 100-300 meters distances in four and 12 channel configurations. The HX Series devices are used in HPC formats, Infiniband, Ethernet and optical high definition multimedia interface (HDMI) components.
LX Series
The GigOptix LX Series of products service the 40Gbps and above telecom! market f! or Mach-Zehnder modulators. The LX Series devices are based on the Company's TFPS EO material technology.
EX Series
The GigOptix EX Series of products leverages the high performance products acquired in the Endwave acquisition. In addition, it also includes the die and design techniques developed for the GX Series telecom and data-com drivers for related defense and instrumentation applications.
CX Series
The GigOptix CX Series of products offers a portfolio of distinct paths to digital and analog mixed signal ASICs with the capability of supporting designs of up to 10M gates in technologies ranging from 0.6 through 65nm. The CX Series uses the Company's technology in Structured and Hybrid ASICs to enable a generic ASIC solution that can be customized for a customer using only a few metal mask layers. The CX Series also offers ASIC services, including Analog and Mixed Signal IP into designs and taking customers designs from RTL or gate-level net list definitions to volume production with third party foundries.
The Company competes with TriQuint, Rohm, InPhi, Centellax, Semtech, Vitesse, M/A-Com, Avago, Emcore, Tyco Electronics, IPtronics. Avago, Emcore, Tyco Electronics, JDSU, Oclaro, Sumitomo, Fujitsu, Emcore, Oclaro, Hittite, Sumitomo, Hittite, RFMD, Northrop Grumman, On -Semiconductor, eSilicon, Open Silicon, Faraday, Toshiba and eASIC.
Advisors' Opinion:- [By Bryan Murphy]
It's admittedly overbought and due for a slight dip thanks to today's surge. But when you take a step back and look at GigOptix Inc. (NYSEMKT:GIG), there's actually a lot to be excited about if you've been mulling a trading in GIG. The trick will be getting the timing right.
Hot Semiconductor Companies To Own In Right Now: NVIDIA Corporation(NVDA)
NVIDIA Corporation provides visual computing, high performance computing, and mobile computing solutions that generate interactive graphics on various devices ranging from tablets and smart phones to notebooks and workstations. It operates in three segments: Graphic Processing Unit (GPU), Professional Solutions Business (PSB), and Consumer Products Business (CPB). The GPU segment offers GeForce discrete and chipset products, which support desktop and notebook personal computers plus memory products. The PSB segment provides its Quadro professional workstation products and other professional graphics products, including its NVIDIA Tesla high-performance computing products used in the manufacturing, entertainment, medical, science, and aerospace industries. The CPB segment offers Tegra mobile products, which support tablets, smartphones, personal media players, Internet television, automotive navigation, and other similar devices. This segment also licenses video game consol es and other digital consumer electronics devices. The company sells its products to original equipment manufacturers, original design manufacturers, add-in-card manufacturers, consumer electronics companies, and system builders worldwide that utilize its processors as a core component of their entertainment, business, and professional solutions. NVIDIA Corporation was founded in 1993 and is headquartered in Santa Clara, California.
Advisors' Opinion:- [By Sean Williams]
This week, we'll dive back into the high-growth tech sector and have a look at why processing and graphics chip maker NVIDIA (NASDAQ: NVDA ) makes for a delectable income play for investors.
Hot Semiconductor Companies To Own In Right Now: Aeroflex Holding Corp (ARX)
Aeroflex Holding Corp. (Aeroflex Holding) is a provider of radio frequency (RF) and microwave integrated circuits, components and systems used in the design, development and maintenance of wireless communication systems. The Company�� solutions include microelectronic components and test and measurement equipment used by companies in the space, avionics and defense; commercial wireless communications, and medical and other markets. Its products include a range of RF, microwave and millimeter wave microelectronic components, integrated circuits (ICs), and analog and mixed-signal devices. It also manufactures a range of RF and microwave wireless radio and avionics test equipment and solutions particularly for the wireless, avionics and radio test markets. The Company operates in two segments: Aeroflex Microelectronics Solutions (AMS) and Aeroflex Test Solutions (ATS). In August 2010, it acquired Advanced Control Components. In September 2013, the Company announced the sale of its Aeroflex Test Equipment Services (ATES) business to Trescal Limited. In February 2014, Aeroflex Holding Corp announced the acquisition of Shenick Network Systems.
Aeroflex Microelectronic Solutions
AMS offers a range of microelectronics products and is a provider of specialty products for the space, avionics, defense, commercial wireless communications, medical and other markets. RadHard products are specifically designed to tolerate high radiation level environments, which otherwise can degrade electronic components. The Company principally operates on a fabless semiconductor manufacturing model, outsourcing virtually all front-end semiconductor fabrication activities to commercial foundries. AMS offers a range of complementary products that provide connectivity and computing functionality for applications. Its product portfolio includes RF, microwave and millimeter wave products, including discrete components, ICs, monolithic microwave ICs and multi-chip modules.
AMS designs and manu! factures application specific, analog and mixed-signal devices for use in medical, industrial and intelligent sensors. The Company�� AMS products are used in over 100 space, avionics and defense platforms, including the Wideband Global Satellite Communications satellites, the Geostationary Operational Environmental satellites, the Advanced Extremely High Frequency satellites, the Boeing 777 airliner's databus, the F-16's modular mission computer, the B-1 flight controls upgrade and the Terminal High Altitude Area Defense program. Its AMS products are also used in wireless communications platforms, including WCDMA and LTE cellular base station systems, as well as point-to-point broadband radio applications. In the medical area, our products are used by two of the top four manufacturers of CT scan equipment.
AMS provides HiRel standard and custom integrated circuits and circuit card assembly for the aerospace, altitude avionics, medical, x-ray cargo scanners, critical transportation systems, nuclear power controls, global positioning systems (GPS) receivers, networking and telecommunication markets. AMS' HiRel products include transceivers, analog multiplexers, clock management generators, MSI logic products, battery electronics units, voltage regulators, high-speed power controllers, MIL-STD 1553 bus controllers, remote terminals, bus monitors, microcontrollers and microprocessors, RadHard Pulse Width Modulation Controllers, RadHard Resolver-to-Digital and memory modules. HiRel Microelectronics/ Semiconductors have a typical life cycle of 10-20 years.
AMS provides a set of standard and application specific RF/microwave diodes and semiconductor devices. Microwave semiconductor products offered include diodes, amplifiers, resistors, inductors, capacitors, switches, and integrated devices. RF and Microwave active components and subsystems offered include PIN diode-based microwave control components, variable attenuators, phase shifters, limiters, time delay units and Multi-Funct! ion Micro! wave assemblies. AMS offers resistor products, which include a variety of low and high reliability power surface mounted passive devices for the wireless infrastructure and defense markets with applications in isolators, circulators, single and multi-carrier power amplifiers and circuits. Passive components offered include attenuators, terminations, adapters, DC blocks, and other components for commercial, military and laboratory applications. Other products include power amplifiers, up and down converters, mixers, filters and micro-receivers operating to over 40 giga hertz (GHz). RF and Microwave components have a typical life cycle of 5-15 years. The Company�� motion control products provide complete and integrated motion control solutions for space (both military and commercial), military, avionics, and industrial customers. Its product line offerings include actuators and mechanisms, electronic controllers, slip rings and twist capsules, DC motors and Gimbal Systems. Motion control products have a typical life cycle of 10-20 years.
Aeroflex Test Solutions
ATS is a provider of a line of specialized test and measurement hardware and software products, primarily for the space, avionics, defense, commercial wireless communications and other markets. ATS products and their applications include wireless test equipment, which is used to develop and test handsets and base stations; military radio and PMR test equipment, which is used by radio manufacturers and military, police, fire, and emergency response units to test handheld radios; avionics test equipment, which is used in the design, manufacture and maintenance of electronics systems for aircraft; synthetic test equipment, which is used to test satellites and transmit / receive modules prior to launch and deployment, and general purpose test equipment, including spectrum analyzers and signal generators.
Wireless Test Equipment is used by wireless service providers and equipment manufacturers to test wireless ! handsets ! and base stations. The Company offers a range of cellular tests across a range of wireless standards and communication frequencies, including 2G and 3G, with particular capability in EDGE protocols, and the new 4G LTE/LTE(A) protocols. Products include a range of system, protocol, physical layer and parametric test solutions, such as the TM500 test mobile, RF synthesizers, digitizers and combiners, and application software. In addition, ATS provides PXI-based products which are modular scalable solutions for the handset manufacturing environment. Product applications include research and development, conformance, manufacturing/production, installation and commissioning, field service, and network optimization.
ATS Radio Test Equipment is used by radio manufacturers and military, police, fire and emergency response units to test handheld radio units. ATS provides TErrestrial Trunked Radio (TETRA), and Project 25 (P25), radio test equipment, addressing both mobile and repeater test applications. TETRA is a global standard for private mobile radio (PMR), systems used by emergency services, public transport and utilities. P25 is a standard for digital radio communications for use by federal, state, private, and local public safety agencies in North America. Its military communications testing systems are primarily used by the United States military to test complex voice and data frequency hopping radios and accessories. Military radio and PMR test equipment has a typical life cycle of 5-20 years.
Avionics test equipment is used in the design, manufacture, test and maintenance of commercial, civil and military airborne electronic systems, or avionics. ATS equipment provides the stimulus and signals necessary for certification, verification, fault finding and diagnosis of airborne systems on the ground. For civil and commercial aviation, it has test solutions for various transponder modes, communications frequencies, emergency locator transmitters, weather radars and GPS systems. F! or milita! ry aviation, it has test solutions for microwave landing systems, tactical air navigation, enhanced traffic alert and collision avoidance systems, various identification friend or foe, or IFF, transponder/interrogator modes and IFF monopulse antenna simulation. ATS also provides customized avionics test solutions to support manual and automatic test equipment for manufacturing, repair and ground support operations. Avionics test equipment has a typical life cycle of 8-15 years.
Synthetic test systems test several attributes through one box and can take multiple complex measurements simultaneously. ATS provides synthetic test environment that allows digital, analog, RF/microwave and power test of circuits, modules, subsystems and complete systems for commercial, military, and aerospace customers. ATS' STI 1000C+ and TRM 1000C products offer synthetic microwave test systems optimized for testing Transmit/Receive modules and satellite payloads in a factory setting. Its SMART^E and SMART^E 5300 products offer a modular approach for implementing multi-function configurable and reconfigurable test systems. Synthetic test solutions products have a typical life cycle of 10-15 years.
ATS offers a variety of general purpose test solutions including microwave test solutions, counters and power meters. ATS microwave test solutions cover frequency ranges from 1 megahertz (MHz) to 46 gigahertz (GHz), with various tracking, offset, continuous wave, modulated source, fault location, and group delay configuration options provided. ATS power meters are designed for field use, automated test equipment requirements and standard bench applications. General purpose test solutions have a typical life cycle of 4-7 years.
The Company Competes with Agilent Technologies, Honeywell, BAE Systems, Hittite Microwave Corporation, ILC / Data Devices Corporation, Microsemi, Anaren, Anite, Anritsu, Rohde & Schwarz, Spirent and National Instruments.
Advisors' Opinion:- [By Rich Smith]
The Department of Defense issued some 22 separate contract awards Thursday, totaling just under $1 billion in combined value. Not all of them went to publicly traded defense contractors, of course, but enough of them did to be worth mentioning. Here are a few of the lucky winners:
Hot Semiconductor Companies To Own In Right Now: M/A-COM Technology Solutions Holdings Inc (MTSI)
M/A-COM Technology Solutions Holdings, Inc. (M/A-COM), incorporated on March 25, 2009, is a provider of high-performance analog semiconductor solutions for uses in wireless and wireline applications across the radio frequency (RF), microwave and millimeter wave spectrum. The Company manages has one segment, which is semiconductors. The Company offers over 2,700 standard and custom devices, which includes integrated circuits (IC), multi-chip modules, power pallets and transistors, diodes, switches and switch limiters, passive and active components and complete subsystems, across 37 product lines serving over 6,000 end customers in four primary markets. The Company's semiconductor products are electronic components that the Company's customers incorporate into their larger electronic systems, such as point-to-point wireless backhaul radios, radar, automobile navigation systems, digital cable television (CATV) set-top boxes, magnetic resonance imaging systems and unmanned aerial vehicles. In February 2014, M/A-COM Technology Solutions Holdings Inc announced that its subsidiary Mindspeed Technologies Inc completed the sale of assets of its wireless infrastructure business unit to Intel Corporation.
The Company's primary markets are Networks, which includes CATV, cellular backhaul, cellular infrastructure and fiber optic applications; Aerospace and Defense (A&D); Automotive, which includes global positioning system (GPS) modules sold to the automotive industry; and Multi-market, which includes industrial, medical, mobile communications and scientific applications. The Company operates a single Gallium Arsenide (GaAs) and silicon semiconductor fab at its Lowell, Massachusetts headquarters, which the Company is in the process of updating to include Gallium Nitride (GaN) fabrication operations as well. The Company also utilizes external semiconductor foundries to supply the Company with additional capacity in periods of high demand and to provide the Company access to additional process technolog! ies. The ability to utilize a broad array of internal process technologies as well as commercially available foundry technologies allows the Company to select the appropriate technology to solve the Company's customers' needs.
The Company offers high-performance analog semiconductor products for both wireless and wireline applications across the frequency spectrum from RF to millimeterwave. The Company regularly develops high-value products to serve its customers in four primary markets: Networks, A&D, Multi-market and Automotives.
Aerospace & Defense
In the A&D market, military applications require more advanced electronic systems, such as radar warning receivers, communications data links and tactical radios, unmanned aerial vehicles (UAVs), RF jammers, electronic countermeasures and smart munitions. Military applications are becoming more sophisticated, favoring higher performance semiconductor ICs based on GaAs and GaN technology due to their high power density, improved power efficiency and broadband capability. Radar systems for mapping and targeting missions are undergoing a transition from existing mechanically-scanned radar products to a new generation of active electronically-scanned array (AESA) based products. Consisting of hundreds or thousands of transmit/receive modules commonly based on GaAs and increasingly on GaN technology, AESAs deliver greater speed, range, resolution and reliability over mechanically-scanned radar products that utilize a single transmitter and receiver with mechanical steering. Military communications employing wireless infrastructure and tactical radios in the field remain critical for allowing geographically dispersed users to exchange information quickly and efficiently. UAVs and their underlying semiconductor content requires designs to meet rigorous specifications for high performance, small size, and low power consumption.
Automotive
The Automotive category includes GPS modules the Company sel! ls to the! automotive industry. Semiconductor content in automobiles is projected to grow in order to offer connectivity, safety, performance and navigation features.
Multi-market
In Multi-market, the Company's products are used in industrial, medical, mobile communications, test and measurement and scientific applications. In the medical industry, the Company's custom designed non-magnetic diode product line is a critical component for certain MRI applications. The Company offers a broad range of standard and custom ICs, modules and complete subsystems across 37 product lines. The Company's product portfolio consists of more than 2,700 products including the key product platforms: power pallets and transistors, ICs, diodes, switches and switch limiters, passive and active components, multi-chip modules, and complete subsystems. Many of the Company's product platforms are leveraged across multiple markets and applications. For example, the Company's applications with regard to power transistor technology is leveraged across both scientific laboratory equipment applications and commercial and defense radar system applications. The Company's diode technology is used in switch filter banks of military tactical radios as well as medical imaging MRI systems.
The Company competes with Hittite Microwave Corporation, Sumitomo Electric Device Innovations, Inc., RF Micro Devices, Inc. (RFMD), Avago, Inc. (Avago), Aeroflex, Inc. (Aeroflex), Microsemi Corporation (Microsemi), TriQuint and Skyworks Solutions, Inc.
Advisors' Opinion:- [By Monica Gerson]
Mindspeed Technologies (NASDAQ: MSPD) surged 69.02% to $5.02 in the pre-market session after M/A-Com Technology Solutions Holdings (NASDAQ: MTSI) announced its plans to acquire Mindspeed Technologies.
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